? 1 ? e01713a1x-ps sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. CXG1126EN 10 pin vson (plastic) high power dp3t switch with logic control description the CXG1126EN is a high power dp3t switch mmic. this ic can be used in wireless communication systems, for example, cdma handsets with gps. the CXG1126EN can be operated by the cmos control. the sony?s g aas jfet pr ocess is used for low insertion loss and on-chip logic circuit. features ? low insertion loss: 0.25db @900mhz, 0.35db @1.5ghz high linearity: iip3 (typ.) = 70dbm 1 cmos compatible control line small package size: 10-pin vson applications dual-band cellular handsets cmda with gps, dual-band cdma structure gaas j-fet mmic absolute maximum ratings (ta = 25c) bias voltage v dd 7v control voltage vctl 5 v operating temperature topr ?35 to +85 c storage temperature tstg ?65 to +150 c gaas mmics are esd sensitive devices. special handling precautions are required.
? 2 ? CXG1126EN block diagram and recommended circuit truth table f4 off on f3 on off f2 off on f1 on off ctl l h on pass rf1 ? rf4, rf2 ? rf5 rf2 ? rf4, rf3 ? rf5 3 6 7 8 9 10 rf4 gnd v dd c rf (100pf) cbypass (100pf) ctl cbypass (100pf) rf5 c rf (100pf) rf1 gnd gnd c rf (100pf) rf2 c rf (100pf) rf3 c rf (100pf) 5 4 1 2 rctl (1k ? ) f1 gnd (recommended) gnd (recommended) f2 f3 f4 item vctl (h) vctl (l) v dd min. 2.0 0 2.6 ty p. 3.0 ? 3.0 max. 3.6 0.4 3.6 unit v v v when using this ic, the following external components should be used: rctl: this resistor is used to improve esd performance. 1k ? is recommended. c rf : this capacitor is used for rf de-coupling and must be used for all application. 100pf is recommended. cbypass: this capacitor is used for dc line filtering. 100pf is recommended. dc bias condition (ta = 25c)
? 3 ? CXG1126EN target specification (ta = 25c) unit db db db db db db db db db db db db db db db db ? dbc dbc dbm dbm s a a max. 0.50 0.60 0.65 0.75 0.65 0.75 0.50 0.60 70 150 ty p. 0.25 0.35 0.40 0.50 0.40 0.50 0.25 0.35 21 18 30 25 30 25 21 18 1.2 ?75 ?75 34 70 2 35 90 min. 18 15 27 22 27 22 18 15 ?60 ?60 60 condition rf1 ? rf4 @900mhz rf1 ? rf4 @1.5ghz rf2 ? rf4 @900mhz rf2 ? rf4 @1.5ghz rf2 ? rf5 @900mhz rf2 ? rf5 @1.5ghz rf3 ? rf5 @900mhz rf3 ? rf5 @1.5ghz rf1 ? rf4 @900mhz rf1 ? rf4 @1.5ghz rf2 ? rf4 @900mhz rf2 ? rf4 @1.5ghz rf2 ? rf5 @900mhz rf2 ? rf5 @1.5ghz rf3 ? rf5 @900mhz rf3 ? rf5 @1.5ghz 900mhz, 1.5ghz ? 1 ? 1 v dd = 3.0v ? 2 vctl (high) =3v v dd = 3v symbol il iso. vswr 2fo 3fo p1db iip3 tsw ictl i dd item insertion loss isolation vswr harmonics 1db compression input power input ip3 switching speed control current bias current vctl (l) = 0v, vctl (h) = 3.0v ? 1 pin = 29dbm, 900mhz, v dd = 3.0v ? 2 pin = 25dbm (900mhz) + 25dbm (901mhz), v dd = 3.0v
? 4 ? CXG1126EN package outline unit: mm 0.05 sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure 10pin vson(plastic) vson-10p-01 0.15 s b a 2.5 2.7 2.5 0.4 b 0.15 s b a 0.05 m s ab x2 x4 s s 0.6 0.5 0.2 0.8 15 6 10 0.35 0.1 0.35 0.1 0.8 ? 0.05 + 0.1 terminal section 0.2 0.01 0.225 0.03 solder plating 0.14 ? 0.03 0.13 0.025 + 0.09 (stand off) 0.03 0.03 pin 1 index 0.013g ranges of 0.1mm and 0.25mm from the end of a terminal. note: 1) the dimensions of the terminal section apply to the
? 5 ? CXG1126EN sony corporation package outline unit: mm 0.05 sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure 10pin vson(plastic) vson-10p-01 0.15 s b a 2.5 2.7 2.5 0.4 b 0.15 s b a 0.05 m s ab x2 x4 s s 0.6 0.5 0.2 0.8 15 6 10 0.35 0.1 0.35 0.1 0.8 ? 0.05 + 0.1 terminal section 0.2 0.01 0.225 0.03 solder plating 0.14 ? 0.03 0.13 0.025 + 0.09 (stand off) 0.03 0.03 pin 1 index 0.013g ranges of 0.1mm and 0.25mm from the end of a terminal. note: 1) the dimensions of the terminal section apply to the lead specifications item lead material copper alloy lead treatment sn-bi 2.5% lead treatment thickness 5-18m spec.
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